Ceramic corundum - WIDCOLD2
WIDCOLD2 is a formula-modified version of WIDCOLD. Thanks to the incorporation of special chemicals and seeds in the crystal phase, WIDCOLD2 exhibits significantly enhanced microchipping features and thermal stability. Consequently, WIDCOLD2 stands out as the abrasive with the highest removal rate, the lowest grind resistance, and optimal thermal release among its peers.
Highlights
Enhanced Microchipping
Improved removal rate and lower grind resistance.
Thermal Stability
Optimal thermal release for demanding applications.
Customizable Shapes
Available in blocky or sharp forms for specific needs.
Features
Formula Modification
Special chemicals and seeds for advanced performance.
Wide Particle Size Range
Available in F8–F1200, compliant with FEPA and GB/T standards.
Bulk Density Options
Custom densities and shapes available on request.
Specifications
| Key | Value |
|---|---|
| Chemical Composition | |
| Al₂O₃ | 96.23 |
| MgO+ZrO₂ | 3.70 |
| Na₂O | 0.02 |
| Fe₂O₃ | 0.02 |
| Others | 0.03 |