Friable Diamond - WD-S
WD-S is a high-grade friable diamond with micron-sized grains, engineered for precision applications requiring exceptional surface finishes. Its superior friability and rough crystal surfaces ensure excellent bond retention, high cutting rates, and minimal heat generation, making it ideal for fine grinding and polishing.
Highlights
Micron-Grade Sharpness
Provides high precision and fine surface finish capabilities.
Superior Friability
Delivers efficient, self-renewing cutting performance.
Features
Enhanced Bond Retention
Rough surfaces improve mechanical bonding in grinding wheels.
Cooling Effect
Reduces workpiece thermal stress through efficient chip evacuation.
Specifications
| Key | Value |
|---|---|
| Grain Structure | Micron-sized, rough surface |
| Friability | High |
| Toughness | Moderate |
| Thermal Stability | Moderate |
| Bond Retention | Enhanced due to rough crystal surfaces |
| Cutting Efficiency | High |
| Heat Generation | Minimal |
| Applications | Fine polishing, micron-level grinding |